Laser Direct Imaging

TZTEK TZDI series laser direct imaging equipment adopts sub-micron precision drive control platform, a new generation of DMD control technology and optical imaging design, and integrates TZTEK vision algorithm, integrating calibration, compensation algorithm and other technologies to ensure higher imaging quality, capacity and registration accuracy. Suitable for image transfer of double-sided, multi-layer, HDI boards in the field of rigid boards, as well as FPC and IC substrates.

Certificate
Model TZDI-6 TZDI-12 TZDI-20 TZDI-25 TZDI-35
Substrate size 630×660 mm 630×810 mm 550×810 mm 530×850 mm 630×810 mm
Substrate thickness 0.025-5.0 mm 0.02-5.0 mm 0.05-5.0 mm 0.05-5.0 mm 0.05-5.0 mm
Limit 6 μm 12 μm 20 μm 25 μm 35 μm
MP analysis 12 μm 20 μm 35 μm 40 μm 50 μm
Line width accuracy ±10% ±10% ±10% ±10% ±10%
Alignment accuracy ±6μm ±8μm ±8μm ±12μm ±12μm
Lnter Layer alignment accuracy 10 μm 16 μm 24 μm 24 μm 24 μm
Maximum capacity 20mj / s @30 20mj / s @14 20mj / s @8 20mj / s @8 20mj / s @8.5
Recommended application IC substrate IC substrate,SLP HDI,MLB,FPC PCB, FPC MLB (inner and outer layer) ceramic substrate
Model TZUVDI-20 TZUVDI-35
Substrate size 600×660 mm 609×810 mm
(550×610 mm, 630×810 mm)
Substrate thickness 0.05-5.0 mm 0.05-5.0 mm
Minimum window 50 μm 100 μm
Minimum resistance welding bridge 50 μm 75 μm
Line width accuracy ±10% ±10%
Alignment accuracy ±12μm ±12μm
Lnter layer alignment accuracy 24 μm 24 μm
Maximum capacity 50seconds / face @ 300MJ 12 seconds / face @ 300MJ
Recommended application Soft board and hard board anti welding, inner and outer circuit Soft board and hard board anti welding, inner and outer circuit
Other / 415nm light source is selected for white oil application
Model TZDI-25R
Substrate size 250×2400 · 520×2400 mm
Substrate thickness 0.02-0.25 mm
Limit 25 μm
MP analysis 40 μm
Line width accuracy ±10%
Alignment accuracy ±30@260×1200μm
Maximum capacity 3m/min@20mj/cm2
Recommended application FPC
Model TZLUVDI-35
Substrate size 630×810 mm
Substrate thickness 0.05-5.0 mm
Minimum window 100 μm
Minimum resistance relding bridge 75 μm
Line width accuracy ±10%
Alignment accuracy ±12μm
Lnter Layer alignment accuracy 24 μm
Maximum capacity10.5s /face @ 500mj/cm2 15s / face @ 1000mj/cm2
Recommended application Soft board and hard board anti welding, inner and outer circuit
Training certificate query
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